A trial LSI (Large scale integration) chip has been developed by NTT DoCoMo, which will enable more than 10 times faster the downlink speed of the current HSDPA/3.5G technology on handsets. The currently used chips in handsets compatible with DoCoMo’s HSDPA service, has a maximum downlink speed of 7.2Mbps. With the new chip incorporated into handsets, it’s expected to be able to reach a downlink speed of 100Mbps.
The more than 10 times faster in speed is needed for the forthcoming mobile system known as Super 3G or Long Term Evolution (LTE) which has been approved by 3rd Generation Partnership Project (3GPP). The specialty of this chip is it consumes pretty much less power, which is only a mere 0.04W. Some more it supports multiple-input multiple-output signal detection and decoding for downlink transmissions at 100Mbps which is the speed needed by the mentioned LTE.
There are also other advancements in this chip such as error correction decoding, which requires more or less the same level of complexity as MIMO signal detection. The new chip will be incorporated into DoCoMo’s ongoing research and development of LTE and International Mobile Telecommunications-Advanced (IMT-Advanced) systems. This is good news for the Japanese mobile users, and they would likely be seen ahead of others to have higher speed of data connectivity for streaming multimedia contents.
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